The IEC 60352-5:2020 standard specifies requirements and tests for solderless press-in connections, ensuring mechanical and electrical stability. The fifth edition updates scope to include broader materials and modernizes testing, such as removing the bend test. Purchase the document via BSI Knowledge Amazon.com
IEC 60352-5 defines requirements and test methods for solderless press-in (press-fit) connections used in electrical and electronic equipment . The latest edition is IEC 60352-5:2020
, which updated the scope to include non-PCB materials and refined testing for modern manufacturing. Official PDF copies are available for purchase through the IEC Webstore ANSI Webstore
. Limited previews for technical review can be found on sites like iTeh Standards Post: Mastering Press-Fit Connections with IEC 60352-5
Reliability in electronics doesn't always require a soldering iron. For high-density boards and complex assemblies, press-in technology
offers a robust, solderless alternative—provided you follow the right standards. What is IEC 60352-5?
It is the global benchmark for "Solderless connections – Part 5: Press-in connections". It ensures that when you press a termination into a plated-through hole, the resulting connection is electrically stable and mechanically sound under harsh conditions. Key Updates in the 2020 Edition: Expanded Scope:
Now covers general electrical equipment, not just telecommunications. Modern Materials:
Includes definitions for 'metal boards' to reflect current industry trends. New Force Data:
Adds requirements for documenting press-in and push-out forces to better understand mechanical performance. Refined Testing:
Reduced the number of required test specimens to streamline qualification without sacrificing quality. Why It Matters for Engineers:
Following this standard allows for comparable test results even when using different tool designs. It provides a clear roadmap for environmental testing (like mechanical shock and atmospheric exposure) to ensure your product survives its lifecycle. iec 60352-5 pdf
Are you working with press-fit technology? Make sure your team is referencing the 2020 version to stay compliant with modern manufacturing practices.
#Engineering #Electronics #IECStandards #Manufacturing #PCBDesign #PressFit summary of the specific test schedules (Qualification vs. Application) outlined in the standard? IEC 60352-5:2020 - iTeh Standards
IEC 60352-5:2020 is the current international standard for solderless press-in connections. This standard provides the fundamental requirements, testing procedures, and practical assembly guidance for press-fit terminations used in electrical and electronic equipment. Standard Overview
Full Title: Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance.
Current Edition: Fifth Edition (5.0), published in July 2020. Total Pages: Approximately 40 pages in the full document.
Primary Objective: To ensure that press-in connections remain electrically stable and mechanically sound under various environmental and atmospheric conditions. Key Technical Requirements IEC 60352-5:2020
IEC 60352-5 standard, titled "Solderless connections – Part 5: Press-in connections – General requirements, test methods and practical guidance,"
defines the technical requirements for making and testing solderless press-in (press-fit) connections in electronic equipment. iTeh Standards Core Purpose and Scope
The primary goal of this standard is to ensure that press-in connections remain electrically stable and mechanically sound under various environmental conditions. iTeh Standards Application
: It applies to terminations with a "press-in zone" inserted into holes on a board. : The latest version, Edition 5.0 (2020)
, expanded the scope from just telecommunication devices to all electrical and electronic equipment and components. Substrates Wire-to-post ratio Post diagonal should be ≥ 1
: While traditionally for printed circuit boards (PCBs), the 2020 update explicitly includes other board types, such as metal boards. iTeh Standards Technical Requirements
The standard specifies critical parameters for the components of a press-fit system: Termination Materials
: Requirements for the materials, dimensions, and surface finishes of the press-in zone. Hole Specifications
: Detailed requirements for the plated-through holes (PTH) on the board, including copper thickness limits and hole diameters.
: Guidelines for the tools used for insertion and removal to ensure consistent results across different manufacturers. iTeh Standards Testing Methodologies IEC 60352-5 establishes two distinct test schedules: iTeh Standards Qualification Test Schedule
: Used to prove the fundamental suitability of a specific press-in zone design, independent of its final application. Application Test Schedule
: Focuses on the performance of a connection once it is implemented within a specific component or system. ANSI Webstore Primary Test Types Include: Mechanical
: Measuring press-in and push-out (extraction) forces to ensure adequate holding strength. Electrical
: Monitoring contact resistance to ensure high-quality signal and power transmission. Environmental
: subjecting connections to climatic stress, such as rapid temperature changes and humidity, to validate long-term reliability. ANSI Webstore Major Changes in Edition 5.0 (2020) Broadened Scope
: Replaced "telecommunication equipment" with "electrical and electronic equipment". Data Visualization Wrap angle For automatic winding machines, a 270°
: Added requirements for graphs to document press-in and push-out force profiles. Test Streamlining
: Removed the outdated bending test and reduced the number of required test specimens. Hole Geometry
: Updated copper thickness limits for plated-through holes to match current market manufacturing practices. iTeh Standards For official access, you can find the full document on the IEC Webstore or through regional standards bodies like BSI Knowledge environmental aging sequences defined in the standard?
While IEC 60352-5 specifies tests, it doesn't provide exhaustive design rules. Based on industrial best practices:
Wire-to-post ratio
Post diagonal should be ≥ 1.2 × wire diameter to avoid excessive stress concentration.
Wrap angle
For automatic winding machines, a 270° initial wrap (3/4 turn) before the full set of turns prevents spring-back.
Wire preparation
For enameled wires: thermal stripping (solder pot at 400°C, 2–3 s) is preferred over mechanical scraping to avoid nicking.
Terminal plating
Sn (tin) is suitable for ≤105°C. Ag (silver) or Au (gold) required for >125°C but risk of electromigration.
Wrapped connections can be unwrapped and re-wrapped several times without damaging the terminal post, provided procedures follow the standard’s guidance.
The standard implicitly relies on the theory of contact resistance:
A: Yes, but many automakers supplement it with additional vibration and temperature cycling requirements. Check your customer-specific CSR (Customer Specific Requirements).
| Parameter | Requirement (Typical) | |-----------|----------------------| | Wire diameter | 0.1 mm to 1.0 mm (extensions for 1.5 mm by agreement) | | Terminal material | Cu-alloy, steel, or brass, typically tin or silver plated | | Number of turns | Minimum: 1.5 (starts: see standard fig.) | | Winding tension | Defined but depends on wire material and diameter | | Post condition | No burrs, correct hardness (typically HV 80–130) |